Nikon Wafer Bump Measure VMR-OCDM-尼康-产品总览-中翰仪器网

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Nikon Wafer Bump Measure VMR-OCDM

产品型号：Nikon Wafer Bump Measure VMR-OCDM

产品名称：Nikon Wafer Bump Measure VMR-OCDM

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Nikon Auto wafer warpage and die shift measuring system


Excellent auto loading system Integrated Nikon high accurancy measurement system ,Achievement ultra wafer loading and measuring

	Overview ‧Available for 12" and 8" wafer warpage and die shift measurement by fully auto ‧Available for resin wafer (eWLB) glass wafer and ultra wapage wafer loading and measuring ‧Maxima wafer wapage tolerance 8" +/- 2000um;12" +/- 4mm ‧Enclosure with FFU,SECS/GEM,Wafer OCR are available for option ‧3 type magnification selectable
‧Available for customize auto loading system